Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470501979
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Textbook Question
Chapter 4, Problem 4.80P
A simplified representation for cooling in very large-scale integration (VLSI) of microelectronics is shown in the sketch. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the remaining surfaces are well insulated from the surroundings. The problem is rendered two-dimensional by the system to be very long in the direction perpendicular to the paper. Under steady-state operation, electric power dissipation in the chip provides for uniform volumetric heating at a rate of
For the conditions shown on the sketch, will the maximum temperature in the chip exceed 85°C, the maximum allowable operating temperature set by industry standards? A grid spacing of 3 mm is suggested.
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Consider the square channel shown in the sketch operating under steady state condition. The inner surface of the
channel is at a uniform temperature of 600 K and the outer surface is at a uniform temperature of 300 K. From a
symmetrical elemental of the channel, a two-dimensional grid has been constructed as in the right figure
below. The points are spaced by equal distance.
Tout = 300 K
k = 1 W/m-K
T = 600 K
(a) The heat transfer from inside to outside is only by conduction across the channel wall. Beginning with
properly defined control volumes, derive the finite difference equations for locations 123. You can
also use (n, m) to represent row and column. For example, location Dis (3, 3), location is (3,1), and
location 3 is (3,5). (hint: I have already put a control volume around this locations with dashed boarder.)
(b) Please use excel to construct the tables of temperatures and finite difference. Solve for the temperatures
of each locations. Print out the tables in the spread…
Fig. 4 illustrates an insulating wall of three homogeneous layers with conductivities k1, k2, and k3 in
intimate contact. Under steady state conditions, both right and left surfaces are exposed to a temperature
in a steady state condition at ambient temperatures of T and T , respectively, while ß, and BLare the
film coefficients respectively. Assume that there is no internal heat generation and that the heat flow is
one-dimensional (dT/dy = 0). For the illustrated ambient temperature in Fig. 4, determine the
temperature's distribution at each layer.
Material 3
Material 1
Material 2
T= 100
T= 35 °C
Kı=20
K3=50 (W/m.k)
K3=30 (W/m.k)
B1= 10 w/m² °K
(W/m.k) BR= 15 w/m²°K
50 mm
35 mm
25 cm
Fig. 4
A brass plate has a circular hole whose diameter is slightly smaller than the diameter of an aluminum ball. Ifthe ball and the plate are always kept at the same temperature,(a) should the temperature of the system be increased or decreasedin order for the ball to fit through the hole? (b) Choose the bestexplanation from among the following:I. The aluminum ball changes its diameter more with temperature than the brass plate, and therefore the temperatureshould be decreased.II. Changing the temperature won’t change the fact that the ballis larger than the hole.III. Heating the brass plate makes its hole larger, and that willallow the ball to pass through.
Chapter 4 Solutions
Fundamentals of Heat and Mass Transfer
Ch. 4 - In the method of separation of variables (Section...Ch. 4 - A two-dimensional rectangular plate is subjected...Ch. 4 - Consider the two-dimensional rectangular plate of...Ch. 4 - A two-dimensional rectangular plate is subjected...Ch. 4 - A two-dimensional rectangular plate is subjected...Ch. 4 - Using the thermal resistance relations developed...Ch. 4 - Free convection heat transfer is sometimes...Ch. 4 - Consider Problem 4.5 for the case where the plate...Ch. 4 - Prob. 4.9PCh. 4 - Based on the dimensionless conduction heat rates...
Ch. 4 - Determine the heat transfer rate between two...Ch. 4 - A two-dimensional object is subjected to...Ch. 4 - An electrical heater 100 mm long and 5 mm in...Ch. 4 - Two parallel pipelines spaced 0.5 m apart are...Ch. 4 - A small water droplet of diameter D=100m and...Ch. 4 - A tube of diameter 50 mm having a surface...Ch. 4 - Pressurized steam at 450K flows through a long,...Ch. 4 - The temperature distribution in laser-irradiated...Ch. 4 - Hot water at 85°C flows through a thin-walled...Ch. 4 - A furnace of cubical shape, with external...Ch. 4 - Laser beams are used to thermally process...Ch. 4 - A double-glazed window consists of two sheets of...Ch. 4 - A pipeline, used for the transport of crude oil,...Ch. 4 - A long power transmission cable is buried at a...Ch. 4 - A small device is used to measure the surface...Ch. 4 - A cubical glass melting furnace has exterior...Ch. 4 - An aluminum heat sink (k=240W/mK), used to cool an...Ch. 4 - Hot water is transported from a cogeneration power...Ch. 4 - A long constantan wire of 1-mm diameter is butt...Ch. 4 - A hole of diameter D=0.25m is drilled through the...Ch. 4 - In Chapter 3 we that, whenever fins are attached...Ch. 4 - An igloo is built in the shape of a hemisphere,...Ch. 4 - Prob. 4.34PCh. 4 - An electronic device, in the form of a disk 20 mm...Ch. 4 - The elemental unit of an air heater consists of a...Ch. 4 - Prob. 4.37PCh. 4 - Prob. 4.38PCh. 4 - Prob. 4.39PCh. 4 - Prob. 4.40PCh. 4 - One of the strengths of numerical methods is their...Ch. 4 - Determine expressionsfor...Ch. 4 - Consider heat transfer in a one-dimensional...Ch. 4 - In a two-dimensional cylindrical configuration,...Ch. 4 - Upper and lower surfaces of a bus bar are...Ch. 4 - Derive the nodal finite-difference equations for...Ch. 4 - Consider the nodal point 0 located on the boundary...Ch. 4 - Prob. 4.48PCh. 4 - Prob. 4.49PCh. 4 - Consider the network for a two-dimensional system...Ch. 4 - An ancient myth describes how a wooden ship was...Ch. 4 - Consider the square channel shown in the sketch...Ch. 4 - A long conducting rod of rectangular cross section...Ch. 4 - A flue passing hot exhaust gases has a square...Ch. 4 - Steady-state temperatures (K) at three nodal...Ch. 4 - Functionally graded materials are intentionally...Ch. 4 - Steady-state temperatures at selected nodal points...Ch. 4 - Consider an aluminum heat sink (k=240W/mK), such...Ch. 4 - Conduction within relatively complex geometries...Ch. 4 - Prob. 4.60PCh. 4 - The steady-state temperatures (°C) associated with...Ch. 4 - A steady-state, finite-difference analysis has...Ch. 4 - Prob. 4.63PCh. 4 - Prob. 4.64PCh. 4 - Consider a two-dimensional. straight triangular...Ch. 4 - A common arrangement for heating a large surface...Ch. 4 - A long, solid cylinder of diameter D=25mm is...Ch. 4 - Consider Problem 4.69. An engineer desires to...Ch. 4 - Prob. 4.71PCh. 4 - Prob. 4.72PCh. 4 - Prob. 4.73PCh. 4 - Refer to the two-dimensional rectangular plate of...Ch. 4 - The shape factor for conduction through the edge...Ch. 4 - Prob. 4.77PCh. 4 - A simplified representation for cooling in very...Ch. 4 - Prob. 4.84PCh. 4 - A long trapezoidal bar is subjected to uniform...Ch. 4 - Consider the system of Problem 4.54. The interior...Ch. 4 - A long furnace. constructed from refractory brick...Ch. 4 - A hot pipe is embedded eccentrically as shown in a...Ch. 4 - A hot liquid flows along a V-groove in a solid...Ch. 4 - Prob. 4S.5PCh. 4 - Hollow prismatic bars fabricated from plain carbon...
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