4-The air inside an electronics package housing has a temperature of 50°C. A "chip" in this housing has internal thermal power generation (heating) rate of 3 X 10 W. This chip is subjected to an air flow resulting in a convective coefficient h of 9 W/m2.C over its two main surfaces which are 0.5 cm X 1.0 cm. Determine the chip surface temperature neglecting radiation and heat transfer from the edges. Ans(T-53.33C).

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
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Chapter7: Forced Convection Inside Tubes And Ducts
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Problem 7.27P
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4-The air inside an electronics package housing has a temperature of
50°C. A "chip" in this housing has internal thermal power generation
(heating) rate of 3 X 10³ W. This chip is subjected to an air flow
resulting in a convective coefficient h of 9 W/m2.C over its two main
surfaces which are 0.5 cm X 1.0 cm. Determine the chip surface
temperature neglecting radiation and heat transfer from the edges.
Ans(T, 53.33C).
Transcribed Image Text:4-The air inside an electronics package housing has a temperature of 50°C. A "chip" in this housing has internal thermal power generation (heating) rate of 3 X 10³ W. This chip is subjected to an air flow resulting in a convective coefficient h of 9 W/m2.C over its two main surfaces which are 0.5 cm X 1.0 cm. Determine the chip surface temperature neglecting radiation and heat transfer from the edges. Ans(T, 53.33C).
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