1. As shown, silicon for computer chips is grown in large cylinders called "boules" that are 300 mm in diameter and 2 m in length. The density of silicon is 2.33 g/cm. Silicon wafers for making integrated circuits ,are sliced from a 2.0-m boule and are typically 0.75 mm thick and 300 mm in diameter. Diamond blade 0.75 mm thickness Si boule 300 mm diameter Cut wafers 2 m a. How wafers can be cut from a many single boule? b. What is the mass of a silicon wafer?
1. As shown, silicon for computer chips is grown in large cylinders called "boules" that are 300 mm in diameter and 2 m in length. The density of silicon is 2.33 g/cm. Silicon wafers for making integrated circuits ,are sliced from a 2.0-m boule and are typically 0.75 mm thick and 300 mm in diameter. Diamond blade 0.75 mm thickness Si boule 300 mm diameter Cut wafers 2 m a. How wafers can be cut from a many single boule? b. What is the mass of a silicon wafer?
Chemistry
10th Edition
ISBN:9781305957404
Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Publisher:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
Chapter3: Stoichiometry
Section: Chapter Questions
Problem 181CP
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